Unmatched in Semiconductor Processing and Handling
Unmatched in Semiconductor Processing and Handling.

3M brings precision, performance and efficiency to your manufacturing process.

Semiconductor industry solutions

  •  Improving Semiconductor Processing and Handling

    If you are involved in semiconductor manufacturing and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology, molding and high purity isotopic materials provide solutions which help enable the uniformity, cleanliness and precision your processes demand.

    For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from materials used in etching and deposition, CMP and surface finishing materials for wafer processing, fluids for thermal management, tape and reel for chip transport and materials for wafer doping and ion implantation.

    And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.

CMP solutions

  • 3M? Trizact? CMP Pads

    Our 3M? Trizact? CMP Pads blend 3M’s know-how in molding, surface modification and microreplication, delivering an innovative pad for Chemical Mechanical Polishing for advanced node semiconductor manufacturing.

  • Pad conditioners for CMP

    3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.

3M™ Novec™ Engineered Fluids for semiconductor manufacturing
  • Thermal management in semiconductor manufacturing

    Keep your cool when fabricating wafers

    The semiconductor fabrication process demands precise temperature control. You can get the performance you need and more when you use 3M Novec Engineered Fluids as your heat transfer working fluid.

    Novec fluids are non-conductive and low-maintenance — providing advantages over many common heat transfer fluids. These dielectric fluids offer a wide range of operating temperatures, making them useful for cold-plate cooling, automated testing, plasma etching and chemical vapor deposition equipment. And they do it all without compromising worker safety or environmental sustainability.

  • Non-flammable cleaners for semiconductor equipment and tools

    Clean, cost-effective semiconductor manufacturing

    Frequent and thorough cleaning of equipment and tools used in semiconductor manufacturing is critical in order to remove particulates and other contaminants that can lead to device failure.

    Unfortunately, some conventional solvents, such as IPA and acetone, are flammable and can be damaging to certain delicate materials. And non-flammable options, such as aqueous cleaning processes, can leave residue and increase risk of corrosion. They may also require higher capital equipment and operating costs.

    That’s why 3M offers non-flammable, advanced cleaning solvents to help address your performance, safety and environmental needs.

Semiconductor manufacturing product categories

  • Adhesives for Temporary Wafer Bonding

    Adhesives for Temporary Wafer Bonding

    Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.

  •  Boron Nitride Cooling Fillers

    Boron Nitride Cooling Fillers

    These micro-structured additives literally improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.

  • Chemicals


    High performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.

  • CMP and Surface Finishing Materials

    CMP and Surface Finishing Materials

    3M CMP and surface finishing materials can help increase productivity, improve yields and provide high quality process performance.

  • Fluoropolymers


    From chemical- and temperature-resistant seals to high-purity wafer carriers, these elastomers and plastics are engineered to reduce contamination.

  • Glass Bubbles

    Glass Bubbles

    These tiny hollow spheres not only reduce weight, but also help improve dimensional stability in flexible polymer chips, printer consoles and more.

  • Specialty Glass

    Specialty Glass

    Glass may not seem high-tech, but these electronic glass powders are used in specialized electronics from chip components to plasma displays.

  • Stable Isotopes

    Stable Isotopes

    Up to 99.9999% pure, these customizable boron dopants meet or exceed industry standards for high purity, and are helping expand R&D possibilities.

  • Tape and Reel

    Tape and Reel

    Help protect your components during shipping and storage to meet your requirements and increase productivity.

  • Test and  Burn-In Sockets

    Test and Burn-In Sockets

    The versatile product design helps enable reliable performance for test and burn-in applications.

Need help finding the right semiconductor product?

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