3M brings precision, performance and efficiency to your manufacturing process.
If you are involved in semiconductor manufacturing and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology, molding and high purity isotopic materials provide solutions which help enable the uniformity, cleanliness and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from materials used in etching and deposition, CMP and surface finishing materials for wafer processing, fluids for thermal management, tape and reel for chip transport and materials for wafer doping and ion implantation.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Our 3M? Trizact? CMP Pads blend 3M’s know-how in molding, surface modification and microreplication, delivering an innovative pad for Chemical Mechanical Polishing for advanced node semiconductor manufacturing.
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
Keep your cool when fabricating wafers
The semiconductor fabrication process demands precise temperature control. You can get the performance you need and more when you use 3M Novec Engineered Fluids as your heat transfer working fluid.
Novec fluids are non-conductive and low-maintenance — providing advantages over many common heat transfer fluids. These dielectric fluids offer a wide range of operating temperatures, making them useful for cold-plate cooling, automated testing, plasma etching and chemical vapor deposition equipment. And they do it all without compromising worker safety or environmental sustainability.
Clean, cost-effective semiconductor manufacturing
Frequent and thorough cleaning of equipment and tools used in semiconductor manufacturing is critical in order to remove particulates and other contaminants that can lead to device failure.
Unfortunately, some conventional solvents, such as IPA and acetone, are flammable and can be damaging to certain delicate materials. And non-flammable options, such as aqueous cleaning processes, can leave residue and increase risk of corrosion. They may also require higher capital equipment and operating costs.
That’s why 3M offers non-flammable, advanced cleaning solvents to help address your performance, safety and environmental needs.
Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
High performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.
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